Title :
Extracting Resistances of Carbon Nanostructures in Vias
Author :
Wu, Wen ; Krishnan, Shoba ; Li, Ke ; Sun, Xuhui ; Wu, Raymond ; Yamada, Toshishige ; Yang, Cary Y.
Author_Institution :
Center for Nanostruct., Santa Clara Univ., Santa Clara, CA
fDate :
March 30 2009-April 2 2009
Abstract :
This paper describes a current-sensing technique to extract the resistances of carbon nanostructures in via interconnects. Test structures designed and fabricated for via applications contain carbon nanofiber (CNF)-metal composites embedded in silicon dioxide (SiO2). Electrical characterization of single CNFs is performed using an atomic force microscope (AFM). This technique yields a metal-CNF contact resistance of 6.4 kOmega and a lowest CNF resistivity of 1.89e-4 Omega-cm.
Keywords :
atomic force microscopy; carbon; contact resistance; integrated circuit interconnections; nanofibres; C-SiO2; atomic force microscope; carbon nanofiber-metal composites; carbon nanostructures; current-sen technique; electrical resistivity; metal-CNF contact resistance; silicon dioxide; via interconnects; Atomic force microscopy; Contact resistance; Electric resistance; Electric variables; Electrical resistance measurement; Electrodes; Nanostructures; Nickel; Scanning electron microscopy; Testing;
Conference_Titel :
Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on
Conference_Location :
Oxnard, CA
Print_ISBN :
978-1-4244-4259-1
DOI :
10.1109/ICMTS.2009.4814603
