DocumentCode :
3152698
Title :
Packaging of microstrip circuits using bed of springs to suppress cavity modes - A replacement for bed of nails
Author :
Rajo-Iglesias, E. ; Kilda, P.S. ; Kishk, A.
Author_Institution :
Dept. Signal Theor. & Comm., Univ. Carlos III de Madrid, Leganes, Spain
fYear :
2010
fDate :
23-28 May 2010
Firstpage :
405
Lastpage :
408
Abstract :
The bed of nails has been demonstrated to be very useful in the design of new confined gap waveguide appearing between parallel metal plates with texture, as well as for removing cavity modes in microstrip circuit packages. As the bed of nails is bulky at low frequencies due to the required height of the nails, a new version of this periodic structure is proposed herein, based on helices instead of nails. Thus, the bed of nails is replaced by a bed of springs. The bed of springs is much more compact for use at low frequencies, and its bandwidth turns out to be similar. Thus, the new spring mattress approach is more comfortable than the Fakirs bed of nails at low frequencies.
Keywords :
electronics packaging; microstrip circuits; waveguides; bed of springs; cavity modes; confined gap waveguide; microstrip circuits; packaging; parallel metal plates; spring mattress approach; Bandwidth; Circuits; Conductors; Frequency; Microstrip; Nails; Packaging; Periodic structures; Springs; Waveguide discontinuities; AMC; Parallel plate mode; gap waveguide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
ISSN :
0149-645X
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2010.5518068
Filename :
5518068
Link To Document :
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