• DocumentCode
    3152871
  • Title

    Array Test Structure for Ultra-Thin Gate Oxide Degradation Issues

  • Author

    Hafkemeyer, Kristian M. ; Domdey, Andreas ; Schroeder, Dietmar ; Krautschneider, Wolfgang H.

  • Author_Institution
    Inst. of Nanoelectron., Hamburg Univ. of Technol., Hamburg
  • fYear
    2009
  • fDate
    March 30 2009-April 2 2009
  • Firstpage
    85
  • Lastpage
    90
  • Abstract
    An array test structure for highly parallelized measurements of ultra-thin MOS gate oxide failures caused by degradation is presented. The test structure allows for voltage stress tests of several thousand NMOS devices under test (DUTs) in parallel to provide a large and significant statistical base regarding soft as well as hard breakdown and stress induced degradation of transistor parameters. The array has been fabricated in a standard 130 nm CMOS technology. As mixed mode technologies provide both thin and thick oxide MOS transistors, different gate oxide thicknesses have been chosen for DUTs and digital control logic which gives the possibility to stress the DUTs with high gate voltages.
  • Keywords
    CMOS integrated circuits; MOSFET; failure analysis; semiconductor device breakdown; semiconductor device testing; 130 nm CMOS technology; NMOS DUT; NMOS device under test; array test structure; device breakdown; digital control logic; mixed mode technology; size 130 nm; thick oxide MOS transistor; transistor parameters; ultrathin MOS gate oxide failure; ultrathin gate oxide degradation; voltage stress test; Breakdown voltage; CMOS logic circuits; CMOS technology; Degradation; Electric breakdown; MOSFETs; Stress; Temperature; Testing; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Conference on
  • Conference_Location
    Oxnard, CA
  • Print_ISBN
    978-1-4244-4259-1
  • Type

    conf

  • DOI
    10.1109/ICMTS.2009.4814616
  • Filename
    4814616