Title :
LVDS signal integrity for video transmission lines
Author :
Brandl, A. ; Recht, E. ; Bar-Natan, V.
Author_Institution :
EL-OP LTD, Rehovot
Abstract :
Transmission of high-speed digital video, at large distances, between camera and signal processing unit is a high concerned topic, especially in military applications, where high integrity is required. In our system a number of transmission methods where examined, for a 7 meters video path that includes a number of discontinuities. Finally LVDS channel link method was selected. This paper will present the analysis and simulations performed in order to gain confidence on the design. The simulations performed led to appropriate design and selection of the transmission media (printed flat cables, printed circuits, cables), the interconnections (connectors) and even of the design (repeaters added). The simulation used IBIS model of the drivers and receivers. For the connectors, the printed flat cable and the wiring cable a model was generated based on the physical layout of the elements. This paper will present the whole transmission path, the analysis and simulations performed and the interactive process that led to a closed system configuration and devices selection
Keywords :
data integrity; driver circuits; electromagnetic compatibility; printed circuits; repeaters; telecommunication cables; transmission lines; video signal processing; video signals; visual communication; IBIS model; LVDS channel link method; LVDS signal integrity; camera; connectors; data integrity; device selection; high-speed digital video transmission; interconnections; military applications; printed circuits; printed flat cable; printed flat cables; repeaters; signal processing; system configuration; transmission media; video path; video transmission lines; wiring cable; Analytical models; Cables; Circuit simulation; Connectors; Digital cameras; Digital signal processing; Performance analysis; Transmission line discontinuities; Transmission lines; Video signal processing;
Conference_Titel :
Electromagnetic Compatibility, 2003. EMC '03. 2003 IEEE International Symposium on
Conference_Location :
Istanbul
Print_ISBN :
0-7803-7779-6
DOI :
10.1109/ICSMC2.2003.1428312