Abstract :
The following topics were dealt with: millimeter wave packaging; FDTD modelling; ultrahigh-speed interconnects; electromagnetic compatibility; electronic packages; substrate integrated waveguide filter; integrated waveguide interconnects; electro-absorption modulated lasers; space mapping; metamaterial transmission lines; bandstop filter; dielectric measurement; nonuniform transmission lines; neural network techniques; microwave device modelling; EBG waveguides; power grid networks; millimeter wave antennas; self-inductance; dielectric loss; integrated circuits; CMOS process.
Keywords :
CMOS integrated circuits; dielectric losses; dielectric measurement; electromagnetic compatibility; inductance; integrated circuit interconnections; integrated circuit packaging; metamaterials; microwave devices; millimetre wave antennas; neural nets; power grids; transmission lines; waveguide filters; CMOS process; EBG waveguides; FDTD modelling; bandstop filter; dielectric loss; dielectric measurement; electro-absorption modulated lasers; electromagnetic compatibility; electronic packages; integrated circuits; integrated waveguide interconnects; metamaterial transmission lines; microwave device modelling; millimeter wave antennas; millimeter wave packaging; neural network techniques; nonuniform transmission lines; power grid networks; self-inductance; space mapping; substrate integrated waveguide filter; ultrahigh-speed interconnects;
Conference_Titel :
Signal Integrity and High-Speed Interconnects, 2009. IMWS 2009. IEEE MTT-S International Microwave Workshop Series on
Conference_Location :
Guadalajara
Print_ISBN :
978-1-4244-2742-0
DOI :
10.1109/IMWS.2009.4814892
