Title :
2007 IEEE International integrated reliability workshop final report
Abstract :
The following topics are dealt with: negative bias temperature stability; mesurement technique; plasma nitrided pMOSFET; DGO CMOS process; reliability issue; flash memory cell; wafer level electromigration tests; high density flash FPGA devices; semiconductor device scaling.
Keywords :
CMOS integrated circuits; MOSFET; field programmable gate arrays; flash memories; semiconductor device measurement; semiconductor device reliability; semiconductor device testing; thermal stability; CMOS process; electromigration tests; flash memory cell; high density flash FPGA devices; mesurement technique; negative bias temperature stability; plasma nitrided pMOSFET; reliability; semiconductor device scaling;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2007. IRW 2007. IEEE International
Conference_Location :
S. Lake Tahoe, CA
Print_ISBN :
978-1-4244-1771-9
DOI :
10.1109/IRWS.2007.4469205
