Dielectric properties of inorganic-organic silica-polyimide composite films prepared via sol-gel and thermal imidization processes

Author

Kim, Youngkyoo ; Ree, Moonhor ; Chang, Taehyun ; Ha, Chang-Sik

Author_Institution

Dept. of Polymer Sci. & Eng., Pusan Nat. Univ., South Korea

Volume

2

fYear

1997

fDate

25 -30 May 1997

Firstpage

882

Abstract

In this study, we prepared inorganic-organic silica-polyimide hybrid composite films from tetraethoxy silane (TEOS) and polyimide precursors via sol-gel process and thermal imidization. The dielectric properties of the silica-polyimide composite films were investigated. In particular, the dependence of the dielectric constant on the polyimide precursor types was discussed

Keywords

VLSI; dielectric thin films; filled polymers; multichip modules; particle reinforced composites; permittivity; polymer films; polymerisation; silicon compounds; sol-gel processing; dielectric constant; dielectric properties; hybrid composite films; polyimide precursors; silica-polyimide composite films; sol-gel preparation; tetraethoxy silane; thermal imidization processes; Dielectric constant; Electrodes; Polyimides; Polymer films; Silicon compounds; Solvents; Thermal expansion; Thermal resistance; Very large scale integration; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and Applications of Dielectric Materials, 1997., Proceedings of the 5th International Conference on

Conference_Location

Seoul

Print_ISBN

0-7803-2651-2

Type

conf

DOI

10.1109/ICPADM.1997.616578

Filename

616578