• DocumentCode
    3153823
  • Title

    A New Multi-Dimensional RF and Microwave Modeling Algorithm Based on Rational Interpolants and Hybrid Mapping

  • Author

    Kashi, Arash ; Roy, Niladri ; Engin, Ege ; Devabhaktuni, Vijay

  • Author_Institution
    Dept. of ECE, San Diego State Univ., San Diego, CA
  • fYear
    2009
  • fDate
    19-20 Feb. 2009
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    A new adaptive multi-dimensional RF/microwave modeling algorithm based on rational interpolants is proposed. For the first time, the algorithm integrates rational functions, genetic concepts, and frequency mapping into a unified CAD tool, which facilitates accurate and fast EM based RF/microwave modeling. Given an RF/microwave modeling problem, highly non-linear and relatively less non-linear model inputs are distinguishable. The algorithm consists of two phases. Starting with a minimal number of EM data and with lowest-order rational functions, Phase 1 systematically produces a sub-model with highly non-linear inputs alone. In Phase 2, an initial overall model is first constructed based on the above sub-model. A hybrid mapping then fine-tunes the initial model to capture the RF/microwave tendencies w.r.t. the less non-linear inputs. The algorithm is illustrated through a practical example.
  • Keywords
    CAD; computational electromagnetics; electromagnetic wave propagation; interpolation; rational functions; adaptive multi-dimensional RF modeling algorithm; frequency mapping; hybrid mapping; lowest-order rational functions; multi-dimensional microwave modeling algorithm; rational interpolants; unified CAD tool; Circuit simulation; Conferences; Design automation; Integrated circuit interconnections; Microwave Theory and Techniques Society; Microwave circuits; RF signals; Radio frequency; Sampling methods; Signal mapping; Design automation; RF/Microwave modeling; Rational approximation; Space mapping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Integrity and High-Speed Interconnects, 2009. IMWS 2009. IEEE MTT-S International Microwave Workshop Series on
  • Conference_Location
    Guadalajara
  • Print_ISBN
    978-1-4244-2742-0
  • Electronic_ISBN
    978-1-4244-2743-7
  • Type

    conf

  • DOI
    10.1109/IMWS.2009.4814912
  • Filename
    4814912