High Frequency SU-8 Based Transmission Line for 3-D Millimeter-wave Antennas

Author

Lee, Sae-Won ; Parameswaran, Ash M. ; Vaughan, Rodney G. ; Mahanfar, Alireza

Author_Institution

Inst. of Micromachine & Microfabrication Res., Simon Fraser Univ., Burnaby, BC

fYear

2009

fDate

19-20 Feb. 2009

Firstpage

101

Lastpage

104

Abstract

A fabrication method and characterization of transmission lines for 3-D millimeter-wave antennas are presented using a polymer micro-electro-mechanical-systems (MEMS) fabrication process. The fabrication process steps are performed at low temperatures and are compatible for on-chip CMOS integration. Blanket metal deposition is applied to the wafer to coat the structures with Au and Cr and electrical isolation is achieved by anchor designs.

Keywords

CMOS integrated circuits; chromium; field effect MIMIC; gold; micromechanical devices; millimetre wave antennas; transmission lines; 3D millimeter-wave antenna; Au; Cr; MEMS fabrication process; blanket metal deposition; electrical isolation; high frequency SU-8 based transmission line; on-chip CMOS integration; polymer microelectro-mechanical-system; CMOS process; Chromium; Fabrication; Frequency; Gold; Micromechanical devices; Millimeter wave technology; Polymers; Temperature; Transmission line antennas; Microelectromechanical devices; Polymers; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Integrity and High-Speed Interconnects, 2009. IMWS 2009. IEEE MTT-S International Microwave Workshop Series on

Conference_Location

Guadalajara

Print_ISBN

978-1-4244-2742-0

Electronic_ISBN

978-1-4244-2743-7

Type

conf

DOI

10.1109/IMWS.2009.4814918

Filename

4814918