A development of inspection techniques for printed circuit board: From 2-D to 3-D

This study presented the techniques developed for printed circuit board defect inspection. In the beginning, visual inspection techniques (2-D image) were developed to identify surface related defects. Technique and strategy for both the direct comparison approach and feature based approach had been proposed and proved to be feasible. Lately, the feasibility of using X-ray laminography techniques to detect defects beneath surface are also study. These studies show a way to fulfill the future need of the industry.