Title :
Highly Reliable Packaging Structure For LiNBO/sub3/ Optical Modulators For High-speed Communication Systems
Author :
Mitsugi, Naoki ; Nagata, Hirotoshi ; Minowa, Junichiro
Keywords :
Bonding; High speed optical techniques; Optical fiber communication; Optical fiber devices; Optical fiber polarization; Optical fibers; Optical materials; Optical modulation; Packaging; Thermal expansion;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
