DocumentCode :
315447
Title :
Flip Chip Market Trends And Infrastructure Limitations
Author :
Vardaman, E. Jan ; Goodman, Thomas
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
37
Lastpage :
40
Keywords :
Bonding; Electronics packaging; Flip chip; Integrated circuit packaging; Integrated circuit technology; Laminates; Microprocessors; Production; Semiconductor device packaging; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618974
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315447
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