• DocumentCode
    315450
  • Title

    Fine Pitch Bonding Technology For Chip-to-chip Adopted Anisotropic Conductive Film

  • Author

    Ozawa, Susumu ; Kitayama, Yuko ; Takahashi, Wataru ; Tohyama, Hiroshi ; Yamashita, Tosimitu

  • fYear
    1997
  • fDate
    16-18 April 1997
  • Firstpage
    51
  • Lastpage
    55
  • Keywords
    Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Electrodes; Heating; Light emitting diodes; Printers; Printing; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
  • Conference_Location
    IEEE
  • Print_ISBN
    0-7803-4235-6
  • Type

    conf

  • Filename
    618977
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=315450