Title :
Fine Pitch Bonding Technology For Chip-to-chip Adopted Anisotropic Conductive Film
Author :
Ozawa, Susumu ; Kitayama, Yuko ; Takahashi, Wataru ; Tohyama, Hiroshi ; Yamashita, Tosimitu
Keywords :
Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Electrodes; Heating; Light emitting diodes; Printers; Printing; Testing; Wire;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
