DocumentCode :
315450
Title :
Fine Pitch Bonding Technology For Chip-to-chip Adopted Anisotropic Conductive Film
Author :
Ozawa, Susumu ; Kitayama, Yuko ; Takahashi, Wataru ; Tohyama, Hiroshi ; Yamashita, Tosimitu
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
51
Lastpage :
55
Keywords :
Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Electrodes; Heating; Light emitting diodes; Printers; Printing; Testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618977
Link To Document :
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