DocumentCode :
315451
Title :
New Flip Chip Bonding Technique Using Transferred Micro Solder Bumps
Author :
Tsunetsugu, Hideki ; Hayashi, Tsuyoshi ; Hosoya, Masakaze ; Katsura, Kohsuke
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
56
Lastpage :
61
Keywords :
Bonding; Closed loop systems; Flip chip; Optical fiber communication; Optical interconnections; Optical materials; Photodiodes; Preamplifiers; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618978
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315451
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