DocumentCode

315455

Title

Direct Nickel Plating on Aluminum Substrate for Microbumps Fabrication

Author

Watanabe, Hideto ; Honma, Hideo

fYear

1997

fDate

16-18 April 1997

Firstpage

101

Lastpage

104

Keywords

Aluminum; Bonding; Electrodes; Fabrication; Nickel; Oxidation; Palladium; Resists; Surface morphology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

618986