Micro-ball Bump Technology For Fine-pitch Interconnections

Author

Shimokawa, Kenji ; Tatsumi, Kohei ; Hashino, Eiji ; Ohzeki, Yoshio ; Konda, Masashi ; Kawakami, Youji

fYear

1997

fDate

16-18 April 1997

Firstpage

105

Lastpage

109

Keywords

Bonding; Electrodes; Flip chip; Gold; Laboratories; Large scale integration; Production; Semiconductor device packaging; Steel; Vacuum arcs;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

Filename

618987

Link To Document