• DocumentCode
    3154585
  • Title

    A study on energy absorption panel of bumper based on impact of pedestrian´s lower leg

  • Author

    Zheng, Guojun ; Men, Yongxin ; Hu, Ping ; Zhao, Fuquan ; Tang, Xiaosheng

  • Author_Institution
    Coll. of Automobile Eng., Dalian Univ. of Technol., Dalian, China
  • fYear
    2011
  • fDate
    16-18 April 2011
  • Firstpage
    3867
  • Lastpage
    3871
  • Abstract
    Considering the narrow space between the bumper and the outside skin, the filling foam can´t be satisfied with the high standard requirements of pedestrian protection regulations. A scheme is proposed in this paper that using an energy absorption panel (EAP) to replaces the filling foam. Firstly, an impact model of collision between the car and a lower leg is built according to Euro NCAP regulations and verified by simulation and test. Secondly, the filling foam is replaced by an EAP and a full factorial experiment is designed. On this base, the influence law of energy absorption for panel material properties and thickness on crash result was obtained. Studies show that: (1) the replacement is a feasible program to obtain better effect of pedestrian protection; (2) the lower yield strength and thinner panel is not necessarily to obtain the better effect, which can be achieved only by reasonable matching between different material strength and panel thickness.
  • Keywords
    automobiles; automotive components; impact testing; road accidents; structural panels; thickness measurement; yield strength; Euro NCAP regulation; bumper; car collision; energy absorption panel; filling foam; full factorial experiment; impact model; material strength; outside skin; panel material property; panel thickness; pedestrian lower leg; pedestrian protection regulation; yield strength; Absorption; Acceleration; Filling; Knee; Leg; Optimization; Vehicles; Automobile; Energy absorption panel; FEM; Lower leg impact; Pedestrian protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Consumer Electronics, Communications and Networks (CECNet), 2011 International Conference on
  • Conference_Location
    XianNing
  • Print_ISBN
    978-1-61284-458-9
  • Type

    conf

  • DOI
    10.1109/CECNET.2011.5768556
  • Filename
    5768556