DocumentCode
3154593
Title
Development of a new program to estimate the conductor temperature of underground transmission cables in the buried ducts
Author
Saito, Takashi ; Nakade, Masahiko ; Kano, Toshiya ; Ishikawa, Tomotada
Author_Institution
Tokyo Electr. Power Co. Inc., Japan
Volume
3
fYear
2002
fDate
6-10 Oct. 2002
Firstpage
1885
Abstract
Tokyo Electric Power Co. and the Japan Research Institute, Ltd. have jointly developed a new conductor temperature estimation program that makes use of the finite element method, as a tool for calculating at high precision the transmission capacity of a cable installed in a buried duct. This program newly incorporates seasonal changes in air and ground temperature, ground-surface boundary conditions for sunlight and radiation, and temperature changes in the depth direction. Heretofore it has been impossible to vary the load current, but this time it was possible to obtain more realistic simulation results than by the previous stationary-current analysis, by allowing transient-current analysis to which daily and seasonal fluctuations are added. And by employing the finite element method, it has become possible to calculate the temperature even for locations other than the cable conductor temperature (example: the cable surface temperature).
Keywords
finite element analysis; load (electric); power cables; power engineering computing; thermal analysis; transmission networks; underground cables; Japan; air temperature; buried ducts; conductor temperature estimation program; finite element method; ground temperature; stationary-current analysis; transient-current analysis; transmission capacity; underground transmission cables; Conductors; Ducts; Finite element methods; Fluctuations; Land surface temperature; Optical fiber cables; Soil measurements; Temperature measurement; Testing; Underground power cables;
fLanguage
English
Publisher
ieee
Conference_Titel
Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES
Print_ISBN
0-7803-7525-4
Type
conf
DOI
10.1109/TDC.2002.1177745
Filename
1177745
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