DocumentCode :
315460
Title :
A New Approach To Cu-cu Direct Bump Bonding
Author :
Suga, Tadatomo ; Yuuki, Fumio ; Hosoda, Naoe
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
146
Lastpage :
151
Keywords :
Argon; Atomic beams; Electrical resistance measurement; Filling; Large scale integration; Packaging; Semiconductor device measurement; Substrates; Temperature; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618995
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315460
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