Title :
Bonding Resistance Of Sbb Technique
Author :
Masahiro Go ; Tomura, Yoshihiro ; Bessho, Yoshihiro ; Shiraisbi, T. ; Eda, Kazuo ; Ishida, Tom
Keywords :
Artificial intelligence; Bonding forces; Conductive adhesives; Electrodes; Gold; Large scale integration; Resins; Stress; Thermal force; Thermal stability;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
