Title :
Development of Low Cost and Reliable Resin Based PRESS CONTACT Technology
Author :
Yoshino, Rei ; Murakami, Toiiioo ; Tanaka, Kei ; Shimada, Toshikazu
Keywords :
Assembly; Costs; Electrodes; Epoxy resins; Flip chip; Gold; Joining processes; Large scale integration; Testing; Wiring;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
