DocumentCode :
315463
Title :
Stud-bump Bonding Technique Onto An Advanced Organic Substrate For MCM-Ls
Author :
Amami, K. ; ShiI aishi, T. ; Itagaki, M. ; Bessho, Y. ; Eda, K. ; Ishida, Tomoyuki
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
164
Lastpage :
168
Keywords :
Bonding; Conductive adhesives; Gold; Large scale integration; Surface-mount technology; Testing; Thermal conductivity; Thermal loading; Thermal resistance; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618998
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315463
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