Title :
Electroless Gold Plating For Semiconductor Package Substrate
Author :
Hasegawa, Kiyoshi ; Takahashi, Akio ; Nakaso, Akishi
Keywords :
Circuits; Copper; Etching; Gold; Heat treatment; Nickel; Semiconductor device packaging; Substrates; Surface contamination; Surface treatment;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
