DocumentCode
315471
Title
Surface Treatment Of Copper Inner-layer With Electroless Copper Plating Using Hypophosphite As A Reducing Agent
Author
Fujinami, T. ; Honma, Hideo
fYear
1997
fDate
16-18 April 1997
Firstpage
234
Lastpage
239
Keywords
Conductive films; Copper; Nickel; Palladium; Rough surfaces; Surface morphology; Surface roughness; Surface treatment; Temperature dependence; Thick film circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619011
Link To Document