DocumentCode :
315471
Title :
Surface Treatment Of Copper Inner-layer With Electroless Copper Plating Using Hypophosphite As A Reducing Agent
Author :
Fujinami, T. ; Honma, Hideo
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
234
Lastpage :
239
Keywords :
Conductive films; Copper; Nickel; Palladium; Rough surfaces; Surface morphology; Surface roughness; Surface treatment; Temperature dependence; Thick film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619011
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315471
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