DocumentCode :
315473
Title :
Charge Build-up In Plasma Cleaning Process Before Wire-bonding
Author :
Arita, Kiyoshi ; Furukawa, Ryouta ; Iwai, Tetsuhiro ; Haji, Hiroshi ; Morisako, Isamu ; Asano, Tanemasa
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
244
Lastpage :
248
Keywords :
Breakdown voltage; Cleaning; Electrodes; MOS capacitors; Plasma applications; Plasma devices; Plasma diagnostics; Plasma materials processing; Printed circuits; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619013
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315473
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