DocumentCode
315473
Title
Charge Build-up In Plasma Cleaning Process Before Wire-bonding
Author
Arita, Kiyoshi ; Furukawa, Ryouta ; Iwai, Tetsuhiro ; Haji, Hiroshi ; Morisako, Isamu ; Asano, Tanemasa
fYear
1997
fDate
16-18 April 1997
Firstpage
244
Lastpage
248
Keywords
Breakdown voltage; Cleaning; Electrodes; MOS capacitors; Plasma applications; Plasma devices; Plasma diagnostics; Plasma materials processing; Printed circuits; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619013
Link To Document