DocumentCode
315474
Title
Rapid Thermal Annealing Of TI-ALN Interfaces
Author
Wang, Youxiang ; Chen, Xin
fYear
1997
fDate
16-18 April 1997
Firstpage
249
Lastpage
253
Keywords
Electronic packaging thermal management; Electronics packaging; Electrons; Mass spectroscopy; Physics; Rapid thermal annealing; Rapid thermal processing; Substrates; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619014
Link To Document