DocumentCode :
315474
Title :
Rapid Thermal Annealing Of TI-ALN Interfaces
Author :
Wang, Youxiang ; Chen, Xin
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
249
Lastpage :
253
Keywords :
Electronic packaging thermal management; Electronics packaging; Electrons; Mass spectroscopy; Physics; Rapid thermal annealing; Rapid thermal processing; Substrates; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619014
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315474
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