On the accuracy of de-embedding technologies for on-wafer measurement up to 170GHz

With the available operation frequency of circuit increasing into tens of gigahertz or even terahertz. The accurate device model will help designer to get excellent circuit performance and reduce design cycles. So for device modeling, the de-embedding technology becomes more critical. In this paper, a new S-parameter matrix calculation de-embedding technology is proposed. A comparison of different de-embedding up to 170 GHz is performed. The results showed that proposed method is with good agreement with measurement and EM 3D simulation result, even up to 170 GHz