Ultra compact, light weight T/R modules constructed by hermetic wafer-level packaging technology

System requirements are becoming more demanding and this trend is likely to continue. Future systems will need to meet more stringent requirements, such as larger bandwidth, faster system response, higher frequency of operation, better SWAP (Size, Weight and Power), it will also need to be realized in the field with these improvements in a timely matter. Integrated multi-function front end modules have been demonstrated using Northrop Grumman Corporation´s (NGC) Wafer-Scale Assembly (WSA) technology. WSA is an enabling technology capable of constructing ultra compact, ultra light weight front end modules for large array systems. In this paper, WSA advantages and system considerations are discussed. Demonstration of WSA circuits and results are presented.