DocumentCode
3154782
Title
A model for EPROM intrinsic charge loss through oxide-nitride-oxide (ONO) interpoly dielectric
Author
Wu, Ken ; Pan, Cheng-Sheng ; Shaw, J.J. ; Freiberger, Philip ; Sery, George
Author_Institution
INTEL Corp., Santa Clara, CA, USA
fYear
1990
fDate
27-29 March 1990
Firstpage
145
Lastpage
149
Abstract
Intrinsic charge loss phenomena of an EPROM cell with an interpoly oxide-nitride-oxide (ONO) stacked film at elevated temperatures are discussed. There are three dominating charge loss mechanisms, which manifest themselves in three distinct phases in time evolution characteristics. The first phase is an initial fast threshold voltage shift which increases with nitride thickness and results from an intrinsic nitride property. The second phase is caused by electrons moving within the nitride. This electron transport follows a linear ohmic-like conduction. The third phase is a long-term charge loss due to electrons leaking through the top oxide. It can be minimized with a thick top oxide. Based on the above observations, a model to describe the intrinsic EPROM charge loss mechanisms is proposed. This model has been useful in developing a novel scaling methodology for an EPROM interpoly ONO films to improve charge retention capability.<>
Keywords
EPROM; dielectric thin films; semiconductor device models; semiconductor-insulator boundaries; silicon compounds; EPROM cell; ONO interpoly dielectric; Si; SiO/sub 2/-Si/sub 3/N/sub 4/-SiO/sub 2/-Si; charge retention capability; electron transport; elevated temperatures; initial fast threshold voltage shift; intrinsic charge loss mechanism; intrinsic nitride property; linear ohmic-like conduction; long-term charge loss; novel scaling methodology; stacked film; time evolution characteristics; Crystallization; Dielectric losses; EPROM; Educational institutions; Nonvolatile memory; Secondary generated hot electron injection; Silicon; Temperature; Threshold voltage; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location
New Orleans, LA, USA
Type
conf
DOI
10.1109/RELPHY.1990.66077
Filename
66077
Link To Document