DocumentCode :
315482
Title :
Development Of A New Leadframe-type Chip Scale Package
Author :
Chiang, C.L. ; Huang, H.C. ; Lee, R.S. ; Cheng, P.H.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
397
Lastpage :
400
Keywords :
Chip scale packaging; Costs; Electronic packaging thermal management; Electronics packaging; Lab-on-a-chip; Lead; Semiconductor device packaging; Thermal conductivity; Thermal resistance; Transfer molding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619045
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315482
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