DocumentCode :
315483
Title :
/sol mu/BGA Chip Scale Electronic Package With Flexible Microcircuitry
Author :
Clatanoff, W.J. ; Schuellcr, G.R.T.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
401
Lastpage :
406
Keywords :
Bonding; Chip scale packaging; Consumer electronics; Copper; Electronic packaging thermal management; Electronics packaging; Flexible printed circuits; Industrial electronics; Integrated circuit interconnections; Integrated circuit packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619046
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315483
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