DocumentCode
315483
Title
/sol mu/BGA Chip Scale Electronic Package With Flexible Microcircuitry
Author
Clatanoff, W.J. ; Schuellcr, G.R.T.
fYear
1997
fDate
16-18 April 1997
Firstpage
401
Lastpage
406
Keywords
Bonding; Chip scale packaging; Consumer electronics; Copper; Electronic packaging thermal management; Electronics packaging; Flexible printed circuits; Industrial electronics; Integrated circuit interconnections; Integrated circuit packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619046
Link To Document