Title :
Analysis of multilayer microstrip line of finite conductor thickness using Quasi-Static Spectral Domain Analysis (SDA) and Single Layer Reduction (SLR) method
Author :
Singh, Paramjeet ; Verma, A.K.
Author_Institution :
Dept. of Electron. Sci., Univ. of Delhi, New Delhi, India
Abstract :
This paper presents a study of Multilayer Microstrip line of finite conductor thickness using Quasi-Static Spectral Domain Analysis (SDA) method. The finite conductor thickness of the strip is replaced by two parallel strips of zero conductor thickness. The Green´s function for the multilayer microstrip line in Fourier domain is obtained by Transverse Transmission Line (TTL) technique. Galerkin´s method is applied to find the effective dielectric constant and impedance. Dielectric Loss of multilayer microstrip line is calculated by converting multilayer microstrip line structure into single layer microstrip line using Single Layer Reduction (SLR) method. The Conductor Loss of microstrip line is calculated by Wheeler´s incremental inductance method. The effect of finite conductor thickness is also analysed on the impedance, effective relative permittivity, dielectric loss and conductor loss.
Keywords :
Galerkin method; Green´s function methods; microstrip lines; permittivity; Fourier domain; Galerkin method; Green function; SDA method; SLR method; TTL technique; Wheeler incremental inductance method; conductor loss; dielectric constant; dielectric loss; finite conductor thickness; multilayer microstrip line; quasistatic spectral domain analysis; relative permittivity; single-layer microstrip line; single-layer reduction method; transverse transmission line technique; Conductors; Dielectric losses; Impedance; Microstrip; Nonhomogeneous media; Strips; Conductor Loss; Dielectric Loss; Multilayer Microstrip Line; Quasi-Static Spectral Domain Analysis (SDA); Single Layer Reduction (SLR); Transverse Transmission Line (TTL);
Conference_Titel :
India Conference (INDICON), 2011 Annual IEEE
Conference_Location :
Hyderabad
Print_ISBN :
978-1-4577-1110-7
DOI :
10.1109/INDCON.2011.6139416