• DocumentCode
    3155153
  • Title

    A simulation-based method for the capacity economics of semiconductors manufacturing fabs

  • Author

    Leu, Jun-Der ; Yu, Yeh-Hsin

  • Author_Institution
    Dept. of Bus. Adm., Nat. Central Univ., Jhongli, Taiwan
  • fYear
    2009
  • fDate
    6-9 July 2009
  • Firstpage
    1793
  • Lastpage
    1797
  • Abstract
    This paper develops a decision support method for the capacity optimization of semiconductors manufacturing enterprise. In it, we intend to find the wafer fabs configuration considering the production throughput and the capital investment so that the production economic can be achieved. This method applies the idea of X-factory, which is widely used in the semiconductors industry, to develop the decision logic. In the optimization process, the eM-Plant based computer simulation model is applied to estimate the economic performance of each candidate configuration. An application case of 200 mm wafer manufacturing fab with 28 product types and 10 processing area shows the quality of the developed method.
  • Keywords
    decision support systems; economics; semiconductor device manufacture; semiconductor industry; X-factory; capacity economics; capacity optimization; capital investment; computer simulation model; decision logic; decision support method; economic performance; production economic; semiconductor industry; semiconductor manufacturing enterprise; semiconductor manufacturing fabrication; wafer fabrication configuration; wafer manufacturing fabrication; Electronics industry; Industrial economics; Investments; Logic; Optimization methods; Production; Pulp manufacturing; Semiconductor device manufacture; Throughput; Virtual manufacturing; Capital efficiency; Semiconductors manufacturing; Simulation; X-factor theory; eM-Plant;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers & Industrial Engineering, 2009. CIE 2009. International Conference on
  • Conference_Location
    Troyes
  • Print_ISBN
    978-1-4244-4135-8
  • Electronic_ISBN
    978-1-4244-4136-5
  • Type

    conf

  • DOI
    10.1109/ICCIE.2009.5223850
  • Filename
    5223850