RF MEMS integration present & future trends

Author

Polla, Dennis L. ; Wolfson, Michael B.

Author_Institution

Defense Adv. Res. Projects Agency, Arlington, VA, USA

fYear

2009

fDate

Jan. 9 2009-Dec. 11 2009

Firstpage

5

Lastpage

7

Abstract

RF MEMS technologies are rapidly being integrated into RF subsystems for a variety of applications of interest to the Department of Defense. New technologies such as RF high-Q MEMS resonators and micromechanical arrays are being developed that will enable filters and other high-performance passive components for fully integrated microsystems. Large off-chip filters will be replaced by arrays of MEMS resonators to enable monolithic chip-scale spectrum analyzers and channelizer. RF MEMS switches are being continually improved for low-loss, high-isolation switching with enhanced reliability critical to the performance of both military and commercial systems.

Keywords

micromechanical resonators; microswitches; microwave filters; spectral analysers; Department of Defense; MEMS resonators; RF MEMS switches; RF high-Q MEMS resonators; filters; integrated microsystems; micromechanical arrays; monolithic chip-scale channelizer; monolithic chip-scale spectrum analyzers; Impedance matching; Micromechanical devices; Nanoelectromechanical systems; Physics; Q factor; Radio frequency; Radiofrequency microelectromechanical systems; Resonator filters; Switches; USA Councils; Impedance matching; Q factor; interface phenomena; micromechanical signal processor arrays; microresonators; microwave filters; microwave switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio-Frequency Integration Technology, 2009. RFIT 2009. IEEE International Symposium on

Conference_Location

Singapore

Print_ISBN

978-1-4244-5031-2

Electronic_ISBN

978-1-4244-5032-9

Type

conf

DOI

10.1109/RFIT.2009.5383747

Filename

5383747