DocumentCode
3156072
Title
Advances in low-temperature passivated silicon solar cells
Author
Aberle, Armin G. ; Hezel, Rudolf
Author_Institution
Inst. fur Solarenergieforschung Hameln/Emmerthal, Germany
fYear
1996
fDate
13-17 May 1996
Firstpage
371
Lastpage
376
Abstract
Significant progress in the area of low-temperature passivated silicon solar cells is reported using silicon nitride films fabricated at 300-400°C in a remote plasma-enhanced chemical vapour deposition system. Due to the low deposition temperature and the high refraction index, these films act as highly efficient surface-passivating antireflection coatings. Application of these SiN films to low-cost silicon solar cell designs turned out to be most successful, as demonstrated by diffused p-n junction cells with efficiencies above 19%, by bifacial p-n junction cells with front and rear efficiencies above 18%, by mask-free evaporated p-n junction cells with efficiencies above 18%, and by MIS inversion layer cells with a new record efficiency of 17.1%
Keywords
antireflection coatings; elemental semiconductors; p-n junctions; plasma CVD; plasma CVD coatings; semiconductor device testing; silicon; solar cells; surface recombination; 17.1 percent; 300 to 400 C; MIS inversion layer; Si; SiN; antireflection coatings; bifacial p-n junction cells; deposition temperature; diffused p-n junction cells; low-temperature passivation; plasma-enhanced chemical vapour deposition; refraction index; silicon solar cells; Chemical vapor deposition; Coatings; Optical films; P-n junctions; Photovoltaic cells; Plasma applications; Plasma chemistry; Plasma temperature; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
Conference_Location
Washington, DC
ISSN
0160-8371
Print_ISBN
0-7803-3166-4
Type
conf
DOI
10.1109/PVSC.1996.564022
Filename
564022
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