Title : 
Advances in low-temperature passivated silicon solar cells
         
        
            Author : 
Aberle, Armin G. ; Hezel, Rudolf
         
        
            Author_Institution : 
Inst. fur Solarenergieforschung Hameln/Emmerthal, Germany
         
        
        
        
        
        
            Abstract : 
Significant progress in the area of low-temperature passivated silicon solar cells is reported using silicon nitride films fabricated at 300-400°C in a remote plasma-enhanced chemical vapour deposition system. Due to the low deposition temperature and the high refraction index, these films act as highly efficient surface-passivating antireflection coatings. Application of these SiN films to low-cost silicon solar cell designs turned out to be most successful, as demonstrated by diffused p-n junction cells with efficiencies above 19%, by bifacial p-n junction cells with front and rear efficiencies above 18%, by mask-free evaporated p-n junction cells with efficiencies above 18%, and by MIS inversion layer cells with a new record efficiency of 17.1%
         
        
            Keywords : 
antireflection coatings; elemental semiconductors; p-n junctions; plasma CVD; plasma CVD coatings; semiconductor device testing; silicon; solar cells; surface recombination; 17.1 percent; 300 to 400 C; MIS inversion layer; Si; SiN; antireflection coatings; bifacial p-n junction cells; deposition temperature; diffused p-n junction cells; low-temperature passivation; plasma-enhanced chemical vapour deposition; refraction index; silicon solar cells; Chemical vapor deposition; Coatings; Optical films; P-n junctions; Photovoltaic cells; Plasma applications; Plasma chemistry; Plasma temperature; Semiconductor films; Silicon;
         
        
        
        
            Conference_Titel : 
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
         
        
            Conference_Location : 
Washington, DC
         
        
        
            Print_ISBN : 
0-7803-3166-4
         
        
        
            DOI : 
10.1109/PVSC.1996.564022