Title :
Configuration Dependence of SiGe HBT Linearity Characteristics
Author :
Qin, Guoxuan ; Jiang, Ningyue ; Wang, Guogong ; Ma, Zhenqiang
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin-Madison Univ., Madison, WI
Abstract :
Linearity characteristics between common-emitter (CE) and common-base (CB) SiGe HBTs are compared at different frequencies, under different bias conditions and at different input/output matching conditions in this paper. It is shown that, without impedance matching at input/output of the devices, the CB configuration exhibits better linearity than the CE configuration under the same input power level and the difference of IMD3 between the two configurations decreases with the increase of operation frequency. However, when both input and output of the devices are impedance-matched for maximum output power Pout , the CE configuration has better linearity than the CB configuration. Furthermore, without varying the input/output matching, the linearity of the two configurations varies with bias in different ways that the linearity of the CE configuration degrades and that of the CB configuration improves as the bias is increased. Under certain impedance and bias conditions, the CB configuration can provide better linearity, besides higher power gain, than the CE configuration
Keywords :
Ge-Si alloys; heterojunction bipolar transistors; impedance matching; intermodulation distortion; microwave bipolar transistors; millimetre wave bipolar transistors; HBT linearity characteristics; SiGe; bias conditions; common-base HBT; common-emitter HBT; impedance matching; input-output matching; operation frequency; power gain; third-order intermodulation; Fingers; Germanium silicon alloys; Heterojunction bipolar transistors; Impedance matching; Intermodulation distortion; Linearity; Microwave integrated circuits; Power generation; Radio frequency; Silicon germanium; Common base (CB); SiGe; common emitter (CE); heterojunction bipolar transistors (HBT); linearity; power gain; third-order intermodulation (IMD3);
Conference_Titel :
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location :
Manchester
Print_ISBN :
2-9600551-8-7
DOI :
10.1109/EMICC.2006.282762