A Low Cost Packaging Solution for Microwave Applications

Author

Wormald, R. ; David, S. ; Panaghiston, G. ; Jeffries, R.

Author_Institution

Filtronic, West Yorkshire

fYear

2006

fDate

10-13 Sept. 2006

Firstpage

205

Lastpage

208

Abstract

Lower cost solutions for packaging GaAs pHEMT devices, MMIC´s and multi chip modules (MCM´s) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed

Keywords

MMIC; high electron mobility transistors; laminates; liquid crystal polymers; microwave field effect transistors; multichip modules; printed circuit manufacture; GaAs; MMIC; PCB manufacturing techniques; high-reliability military applications; liquid crystal polymer laminates; low cost packaging; microwave applications; multi chip modules; near hermetic packaging; pHEMT devices; phased array applications; Circuits; Copper; Costs; Dielectrics; Electromagnetic heating; Laminates; Liquid crystal polymers; Packaging; Phased arrays; Radio frequency; Liquid crystalline polymer (LCP); Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

European Microwave Integrated Circuits Conference, 2006. The 1st

Conference_Location

Manchester

Print_ISBN

2-9600551-8-7

Type

conf

DOI

10.1109/EMICC.2006.282788

Filename

4057611