Title :
A Compact 500-mW Ku-band Power Amplifier MMIC in 3×3-mm2 Quad Flat (QFN) Packages
Author :
Bessemoulin, A. ; Suh, Y.H. ; Richardson, D. ; Mahon, S.J. ; Harvey, J.T.
Author_Institution :
Mimix Broadband Inc., Houston, TX
Abstract :
This paper presents the performance of a 0.5-Watt Ku-band power amplifier MMIC in low cost surface mount quad flat non-leaded packages (QFN). Depending on the technology used (molded or air-cavity QFN packages), the packaged 2-stage amplifier exhibits high-gain ranging from 18- to 20 dB at Ku-band, with more than 27-dBm (500-mW) CW output power, and up to 29-dBm in saturation (800 mW) at 13.75-14.5 GHz. With a die area of only 1.5 mm2 and QFN packages being 3 mm × 3 mm, these results represents the highest output power levels reported to date for amplifier MMICs packaged in the smallest outline
Keywords :
III-V semiconductors; MMIC power amplifiers; gallium arsenide; surface mount technology; wide band gap semiconductors; 13.75 to 14.5 GHz; 18 to 20 dB; 500 mW; 800 mW; GaAs; Ku-band power amplifier MMIC; air-cavity QFN packages; molded QFN packages; quad flat nonleaded packages; surface mount packages; Assembly; Bonding; Ceramics; Costs; High power amplifiers; Integrated circuit packaging; MMICs; Packaging machines; Plastics; Power amplifiers; Ceramics; GaAs; MMIC; Power amplifiers; QFN; SMD; packaging;
Conference_Titel :
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location :
Manchester
Print_ISBN :
2-9600551-8-7
DOI :
10.1109/EMICC.2006.282794
