DocumentCode :
3158229
Title :
Foturan Cap and BCB Sealing-Ring for RF MEMS Packaging Applications
Author :
Peyrou, David ; Pons, Patrick ; Nicolas, Amaud ; Tao, Jun-Wu ; Granier, Hugues ; Plana, Robert
Author_Institution :
LAAS-CNRS, Toulouse
fYear :
2006
fDate :
10-13 Sept. 2006
Firstpage :
456
Lastpage :
459
Abstract :
RF-MEMS switches devices are made of moveable and timy structures (beams) that must be encapsulated in order to protect them from harmful environmental influences, to increase their reliability and lifetime. This paper presents a packaging solution based on a micromachined Foturan cap and BCB sealing. In order to validate the packaging technology, RF switch onto coplanar waveguide lines for 6-18 GHz was designed using HFSS software package, and fabricated. The demonstrator was characterised in terms of return and insertion losses measurements. The agreement between the modelling and the measurements is very good, and validates the technological approach, which assures insignificant impact of the package on the RF losses
Keywords :
electronics packaging; microswitches; seals (stoppers); 6 to 18 GHz; BCB sealing-ring; Foturan cap; HFSS software package; RF MEMS packaging applications; RF switch; coplanar waveguide lines; s-parameters; Coplanar waveguides; Insertion loss; Loss measurement; Packaging; Protection; Radio frequency; Radiofrequency microelectromechanical systems; Software design; Software packages; Switches; BCB; Flip Chip; Foturan®; Packaging; RF-MEMS; S-parameters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location :
Manchester
Print_ISBN :
2-9600551-8-7
Type :
conf
DOI :
10.1109/EMICC.2006.282681
Filename :
4057675
Link To Document :
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