• DocumentCode
    3158229
  • Title

    Foturan Cap and BCB Sealing-Ring for RF MEMS Packaging Applications

  • Author

    Peyrou, David ; Pons, Patrick ; Nicolas, Amaud ; Tao, Jun-Wu ; Granier, Hugues ; Plana, Robert

  • Author_Institution
    LAAS-CNRS, Toulouse
  • fYear
    2006
  • fDate
    10-13 Sept. 2006
  • Firstpage
    456
  • Lastpage
    459
  • Abstract
    RF-MEMS switches devices are made of moveable and timy structures (beams) that must be encapsulated in order to protect them from harmful environmental influences, to increase their reliability and lifetime. This paper presents a packaging solution based on a micromachined Foturan cap and BCB sealing. In order to validate the packaging technology, RF switch onto coplanar waveguide lines for 6-18 GHz was designed using HFSS software package, and fabricated. The demonstrator was characterised in terms of return and insertion losses measurements. The agreement between the modelling and the measurements is very good, and validates the technological approach, which assures insignificant impact of the package on the RF losses
  • Keywords
    electronics packaging; microswitches; seals (stoppers); 6 to 18 GHz; BCB sealing-ring; Foturan cap; HFSS software package; RF MEMS packaging applications; RF switch; coplanar waveguide lines; s-parameters; Coplanar waveguides; Insertion loss; Loss measurement; Packaging; Protection; Radio frequency; Radiofrequency microelectromechanical systems; Software design; Software packages; Switches; BCB; Flip Chip; Foturan®; Packaging; RF-MEMS; S-parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Microwave Integrated Circuits Conference, 2006. The 1st
  • Conference_Location
    Manchester
  • Print_ISBN
    2-9600551-8-7
  • Type

    conf

  • DOI
    10.1109/EMICC.2006.282681
  • Filename
    4057675