DocumentCode
3158229
Title
Foturan Cap and BCB Sealing-Ring for RF MEMS Packaging Applications
Author
Peyrou, David ; Pons, Patrick ; Nicolas, Amaud ; Tao, Jun-Wu ; Granier, Hugues ; Plana, Robert
Author_Institution
LAAS-CNRS, Toulouse
fYear
2006
fDate
10-13 Sept. 2006
Firstpage
456
Lastpage
459
Abstract
RF-MEMS switches devices are made of moveable and timy structures (beams) that must be encapsulated in order to protect them from harmful environmental influences, to increase their reliability and lifetime. This paper presents a packaging solution based on a micromachined Foturan cap and BCB sealing. In order to validate the packaging technology, RF switch onto coplanar waveguide lines for 6-18 GHz was designed using HFSS software package, and fabricated. The demonstrator was characterised in terms of return and insertion losses measurements. The agreement between the modelling and the measurements is very good, and validates the technological approach, which assures insignificant impact of the package on the RF losses
Keywords
electronics packaging; microswitches; seals (stoppers); 6 to 18 GHz; BCB sealing-ring; Foturan cap; HFSS software package; RF MEMS packaging applications; RF switch; coplanar waveguide lines; s-parameters; Coplanar waveguides; Insertion loss; Loss measurement; Packaging; Protection; Radio frequency; Radiofrequency microelectromechanical systems; Software design; Software packages; Switches; BCB; Flip Chip; Foturan®; Packaging; RF-MEMS; S-parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location
Manchester
Print_ISBN
2-9600551-8-7
Type
conf
DOI
10.1109/EMICC.2006.282681
Filename
4057675
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