Title :
Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application
Author :
Markov, Kostyantyn ; Keiler, Torsten ; Chernyakov, Alexander ; Curtin, Ciaran ; Heide, Patric
Author_Institution :
Product Dev. Modules, EPCOS AG, Munich
Abstract :
This paper investigates the design and evaluation of low temperature co-fired ceramic (LTCC) heatsinks in frontend modules (FEMs) with integrated power amplifiers (PAs) for wireless-LAN IEEE 802.11 applications. The thermal resistance of this heatsink is measured using two chip thermistors and the accuracy of the proposed measurement method is determined. This method is experimentally validated by the high temperature operating life (HTOL) test, and reliability data is extracted for an EPCOS WLAN FEM with integrated PA, which is currently in mass production
Keywords :
ceramic packaging; heat sinks; power amplifiers; thermal resistance; thermistors; wireless LAN; chip thermistors; frontend modules; high temperature operating life test; integrated power amplifiers; low temperature co-fired ceramic heatsinks; thermal resistance; wireless LAN; Ceramics; Electrical resistance measurement; Heat sinks; Life testing; Power amplifiers; Semiconductor device measurement; Temperature; Thermal resistance; Thermistors; Wireless LAN; LTCC; Thermal resistance; modules; thermistors;
Conference_Titel :
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location :
Manchester
Print_ISBN :
2-9600551-8-7
DOI :
10.1109/EMICC.2006.282705
