Title :
A New Compact 3-D Hybrid Coupler Using Multi-Layer Microstrip Lines at 15 GHz
Author :
Jung Gil Yang ; Jeong, Yongsik ; Choi, Sunkyu ; Yang, Kyounghoon
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon
Abstract :
This paper presents a new compact 90deg hybrid coupler using thin-film microstrip and inverted microstrip lines for monolithic microwave integrated circuit (MMIC) applications. In order to reduce an intrinsic circuit area of the hybrid coupler, a compact meandered line configuration and a new multi-layer structure design have been adopted. The configuration and structural dimensions of the multi-layer structure were designed and investigated through detailed 3D electromagnetic simulations. The proposed 3D hybrid coupler was realized using a developed benzocyclobutene (BCB)-based multi-layer MMIC technology. The intrinsic area of the fabricated 3D hybrid coupler is significantly reduced compared to that of a conventional hybrid coupler using the 2D meandered line configuration
Keywords :
MMIC; microstrip couplers; 15 GHz; 2D meandered line configuration; 3D electromagnetic simulations; 3D hybrid coupler; benzocyclobutene; inverted microstrip lines; monolithic microwave integrated circuit; multilayer MMIC technology; multilayer microstrip lines; thin-film microstrip lines; Coupling circuits; Distributed parameter circuits; Impedance; MIM capacitors; MMICs; Microstrip; Topology; Transistors; Transmission line matrix methods; Transmission lines; 90° hybrid coupler; BCB; MMIC; meandered line; multi-layer structure;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281172
