A Top-Down approach to automated generation of high-level SPICE model of Buck Regulator

Author

Khawas, Arnab ; Muradali, Fidel ; Banerjee, Amitava ; Mukhopadhyay, Siddhartha

Author_Institution

Electr. Eng. Dept., IIT Kharagpur, Kharagpur, India

fYear

2011

fDate

16-18 Dec. 2011

Firstpage

1

Lastpage

6

Abstract

High-level SPICE modeling or Macromodeling of Analog and Mixed-Signal circuits, involving ideal controlled sources, passive R-L-C components, diodes, is a significant benefit for system level simulation, design-space exploration, inter-process migration and test-development etc. In this work, a Top-Down method is proposed for generating parameterized high-level SPICE models of analog cell level components from an existing SPICE template library. For implementing the Top-Down tool, a generic Equation-Solver is developed to calculate the model parameter values depending on cell level specifications. The developed Equation-Solver is capable of solving any directly solvable non-linear circuit equation. Therefore, the tool is useful to construct model of non-linear analog subsystems in addition to linear analog components. The accuracy and efficiency of the proposed approach, in terms of simulation time complexity, is demonstrated using a developed cell level SPICE model of a benchmark DC-DC Buck Regulator circuit.

Keywords

RLC circuits; SPICE; computational complexity; mixed analogue-digital integrated circuits; power convertors; DC-DC buck regulator circuit; SPICE template library; analog macromodeling; cell level component; design-space exploration; equation-solver; high-level SPICE model; interprocess migration; linear analog component; mixed-signal circuit; model parameter value; nonlinear analog subsystem; nonlinear circuit equation; passive R-L-C component; simulation time complexity; system level simulation; top-down approach; Equations; Integrated circuit modeling; Libraries; Mathematical model; Regulators; SPICE; Transistors; Current-Mode Controlled DC-DC Buck Regulator; Equation-Solver; SPICE Modeling; Top-Down Method;

fLanguage

English

Publisher

ieee

Conference_Titel

India Conference (INDICON), 2011 Annual IEEE

Conference_Location

Hyderabad

Print_ISBN

978-1-4577-1110-7

Type

conf

DOI

10.1109/INDCON.2011.6139629

Filename

6139629