DocumentCode :
3159505
Title :
Corner effects in SOI-tri gate FinFET structure by using 3D process and device simulations
Author :
Kumar, M. Pavan ; Gupta, Santosh Kr ; Paul, Madhumita
Author_Institution :
ECE Dept., NIT Silchar, Silchar, India
fYear :
2010
fDate :
17-19 Sept. 2010
Firstpage :
683
Lastpage :
686
Abstract :
SOI FinFET transistors have emerged as novel devices having superior controls over short channel effects (SCE) than the conventional MOS transistor devices. However despite these advantages, these also exhibit certain other undesirable characteristics such as corner effects, quantum effects, tunneling etc. Usually, the corner effect deteriorates the performance by increasing the leakage current. In this work, the corner effect of Tri-gate FinFETs are investigated by 3D Process and device simulation and their electrical characteristics are compared for different body doping and bias conditions. It has been observed that the corner effect in small size SOI tri gated FinFETs for typical device parameters do not deteriorate the performance. An enhancement in the on state current and sub-threshold performance have been observed.
Keywords :
MOSFET; leakage currents; semiconductor device models; semiconductor process modelling; silicon-on-insulator; 3D process; MOS transistor devices; SOI-tri gate FinFET structure; bias conditions; body doping; corner effects; device simulations; leakage current; on state current; quantum effects; short channel effects; subthreshold performance; tunneling; Doping; FinFETs; Logic gates; Three dimensional displays; Threshold voltage; Corner effect; Premature inversion; Quantum Effect; SCE; Tri gate-FinFET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer and Communication Technology (ICCCT), 2010 International Conference on
Conference_Location :
Allahabad, Uttar Pradesh
Print_ISBN :
978-1-4244-9033-2
Type :
conf
DOI :
10.1109/ICCCT.2010.5640457
Filename :
5640457
Link To Document :
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