DocumentCode :
3159554
Title :
Grain boundaries in silicon: microstructure and minority carrier recombination
Author :
Krinke, J. ; Albrecht, M. ; Dorsch, W. ; Voigt, A. ; Strunk, H.P. ; Steiner, B. ; Wagner, G.
Author_Institution :
Inst. fur Werkstoffwissenschaften, Erlangen-Nurnberg Univ., Germany
fYear :
1996
fDate :
13-17 May 1996
Firstpage :
473
Lastpage :
476
Abstract :
The authors investigate the correlation between the microstructure and the minority carrier recombination of grain boundaries in thin silicon films solution grown with liquid phase epitaxy on cast silicon. We directly correlate electron beam induced current measurements with transmission electron microscope investigations identical grain boundaries in the epitaxial layers. The electrical recombination activity of grain boundaries may be caused or influenced by the microstructure, i.e. precipitates, dislocations and the atomic arrangement. Our investigations reveal that symmetric tilt boundaries show a much lower minority carrier recombination than asymmetric or microfaceted tilt boundaries
Keywords :
EBIC; dislocation structure; electron-hole recombination; elemental semiconductors; grain boundaries; liquid phase epitaxial growth; minority carriers; semiconductor epitaxial layers; silicon; tilt boundaries; transmission electron microscopy; Si; dislocations; electrical recombination activity; electron beam induced current; grain boundaries; liquid phase epitaxy; microfaceted tilt boundaries; microstructure; minority carrier recombination; precipitates; symmetric tilt boundaries; thin Si films; transmission electron microscope; Current measurement; Electron beams; Epitaxial growth; Epitaxial layers; Grain boundaries; Microstructure; Semiconductor films; Silicon; Spontaneous emission; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
Conference_Location :
Washington, DC
ISSN :
0160-8371
Print_ISBN :
0-7803-3166-4
Type :
conf
DOI :
10.1109/PVSC.1996.564046
Filename :
564046
Link To Document :
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