Title :
Development of High-Performance Band Pass Filter in the V-Frequency Band using Multilayer MCM-D Technology
Author :
Yoo, Chan-Sei ; Song, Sang-Sub ; Kim, Dong-Hwan ; Lee, Woo-Sung ; Kang, Nam-Kee ; Park, JongChul ; Seo, Kwang-Seok
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ.
Abstract :
Novel system-on-package (SOP)-D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was 4times107/7 Sm. The insertion loss of band pass filter at 55 GHz was 2.6 dB and group delay was below 0.06 ns. In filter structure, loading capacitor operates as a frequency controller without distortion of inband performance. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-wave system including flip-chip bonded MMIC. In final manuscript, the electrical characteristics of BCB layer upto mm-wave region using ring, T resonator method will be included
Keywords :
band-pass filters; electrical conductivity; millimetre wave filters; multichip modules; multilayers; system-in-package; 2.6 dB; 55 GHz; MCM-D technology; V-band; band pass filter; electrical conductivity; frequency controller; millimeter-wave filters; multichip modules; system-on-package; Band pass filters; Capacitors; Circuits; Conductivity; Delay; Frequency; Insertion loss; Mechanical factors; Nonhomogeneous media; Resonator filters; Band Pass Filter; SOP-D; V-band;
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
DOI :
10.1109/EUMC.2006.281213
