Title : 
An energy efficient hybrid FPGA-GPU based embedded platform to accelerate face recognition application
         
        
            Author : 
Kumar Rethinagiri, Santhosh ; Palomar, Oscar ; Moreno, Javier Arias ; Unsal, Osman ; Cristal, Adrian
         
        
            Author_Institution : 
BSC-Microsoft Res. Centre, Barcelona, Spain
         
        
        
        
        
        
            Abstract : 
Nowadays face recognition application is widely used in various industries such as traffic, safety, medical engineering, etc. In this paper, we propose a power and energy efficient heterogeneous platform to accelerate face recognition applications. To achieve this efficiency, we propose a novel hybrid platform which consists of a Xilinx Zynq (ARM+FPGA) and an NVidia´s Jetson TK1 (ARM+GPU) coupled with PCIe card. In this application, we optimized local binary pattern and eigenvalue based face detection and recognition in order to achieve a speedup of 69x when compared to sequential execution on the ARM core, 4.8x against Zynq platform (ARM+FPGA), 3.2x against NVidia platform (ARM+GPU) and 40% more energy efficient against sequential execution.
         
        
            Keywords : 
eigenvalues and eigenfunctions; energy conservation; face recognition; field programmable gate arrays; graphics processing units; microprocessor chips; ARM core; ARM+FPGA; ARM+GPU; NVidia Jetson TK1; NVidia platform; PCIe card; Xilinx Zynq; Zynq platform; eigenvalue based face detection and recognition; energy efficient hybrid FPGA-GPU based embedded platform; face recognition application; hybrid platform; local binary pattern; sequential execution; Computer architecture; Energy efficiency; Face detection; Face recognition; Field programmable gate arrays; Graphics processing units; Prototypes; ARM; FPGA; Face recognition; GPU; embedded high performance platform; face detection;
         
        
        
        
            Conference_Titel : 
Low-Power and High-Speed Chips (COOL CHIPS XVIII), 2015 IEEE Symposium in
         
        
            Conference_Location : 
Yokohama
         
        
        
            DOI : 
10.1109/CoolChips.2015.7158532