Title :
Study of Discrete Capacitor Embedded Process and Characterization Analysis in Organic-Base Substrate
Author :
Wu, Sung-Mao ; Jahja, Endruw ; Yen, Wen-Kuan ; Wang, Jui-Wen
Author_Institution :
Nat. Univ. of Kaohsiung, Kaohsiung
Abstract :
In this study, an integrated process flow to place more than one discrete chip-type passive components in multilayer organic substrate by build via is presented, reliability test by JEDEC standard is shown too. The phenomenon of simultaneous switch noise (SSN) reduce by decoupling capacitor is measured and simulated by high frequency probing technology and full-wave 3D electromagnetic simulation tools.
Keywords :
capacitors; noise; reliability; substrates; JEDEC standard; characterization analysis; decoupling capacitor; discrete capacitor embedded process; discrete chip-type passive components; full-wave 3D electromagnetic simulation tools; high frequency probing technology; integrated process flow; multilayer organic substrate; organic-base substrate; reliability test; simultaneous switch noise; Capacitors; Electromagnetic interference; Electromagnetic measurements; Frequency measurement; Noise measurement; Noise reduction; Nonhomogeneous media; Semiconductor device measurement; Switches; Testing; Embedded substrate; blind via; passive embedded process flow; simultaneous switching noise (SSN);
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469689
