Title :
Fabrication and Characterization of Multi-layer Liquid Crystal Polymer (LCP) Substrate
Author :
Haijing, Lu ; Lai, Wai Lai ; Wen, Gian Pung ; Huat, Lim Lay ; Zheng, Sun ; Wai, Albert Lu Chee
Author_Institution :
Singapore Inst. of Manuf. Technol. (SIMTech), Singapore
Abstract :
The liquid crystal polymer (LCP) material is a unique class of high temperature thermoplastic. It offers a combination of electrical, thermal, mechanical and chemical properties unmatched by conventional polymers. LCP has very stable and low-loss dielectric characteristics. In addition, the moisture absorption is very low. This paper describes the multi-layer substrate fabrication process and the test vehicle design. Network analyzer measurement up to 20 GHz for transmission line characterization was also performed.
Keywords :
dielectric materials; integrated circuit interconnections; liquid crystal polymers; materials testing; network analysers; plastics; high temperature thermoplastic; high-density interconnection; multilayer circuit integration; multilayer liquid crystal polymer substrate; multilayer substrate fabrication process; network analyzer measurement; test vehicle design; transmission line characterization; Absorption; Chemicals; Crystalline materials; Dielectric materials; Dielectric substrates; Fabrication; Liquid crystal polymers; Mechanical factors; Moisture; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469699
