Formation of Embedded Microchannels by a Solvent Displacement Bonding Technique

We introduce a novel adaptation of the solvent bonding of polymer substrates to create embedded microchannels for application in the fabrication of microfluidic devices. The technique involves the use of a thermally activated solvent and the displacement of solvent in the microchannel. A typical process time is 5 to 10 minutes and high strength sealing with a clear bonding interface can be achieved. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least 6 bars (87 psi) of internal pressure (gauge) in the microchannel.