DocumentCode
3160309
Title
Electronics Packaging for High Reliable Piezoactuators
Author
Oppermann, Martin ; Lenk, Andreas ; Schönecker, Andreas ; Schuh, Carsten ; Zerna, Thomas ; Wolter, Klaus-Jürgen
Author_Institution
Tech. Univ. Dresden, Dresden
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
400
Lastpage
405
Abstract
The use of electronic systems in automotive applications is characterized by special requirements concerning surrounding conditions, e.g. near the engine or breaks, and reliability demands. More and more piezoceramic sensors and actuators become common in such systems. Especially piezoceramic actuators are characterized by high power, low volume, fast mechanical response to an electrical pulse and a high variety of possible geometries. One application of such actuators is to drive fuel injection valves in internal combustion engines like diesel engines or petrol engines. The goal of the project group during the past years was the development and evaluation of a safe and reliable connecting and packaging technology for piezoceramic actuators in this field of application. Our paper presents, based on the general demands to the actuators and so to the technologies, the investigations that have been made, the realized tests (reliability test, endurance run), some results of destructive and non-destructive diagnostics (cross sections, X-ray) to assess the interconnections and the general results of the project.
Keywords
automotive electronics; electronics packaging; fuel systems; interconnections; internal combustion engines; nondestructive testing; piezoceramics; piezoelectric actuators; reliability; valves; X-ray nondestructive diagnostics; destructive diagnostics; diesel engines; electronics packaging; endurance run test; fuel injection valves driving actuation; high reliable piezoactuators; interconnections assessment; internal combustion engines; petrol engines; piezoceramic actuators; reliability test; Actuators; Automotive applications; Diesel engines; Electronics packaging; Internal combustion engines; Mechanical sensors; Nondestructive testing; Piezoelectric materials; Power system reliability; Sensor phenomena and characterization;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469701
Filename
4469701
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